Cotto Possagno for the first time at the BAU Munich fair

The future of construction passes through Munich for the 2025 edition of BAU fair.
We will be present for the first time at the leading fair for architecture, materials and systems. A meeting hub for operators in the design and construction of buildings: architects, designers, investors, representatives of the industrial and commercial sector. Innovation, technology and new applications will be the focus of interest.
In addition to presenting its most technological products to the European public, E-coppo and E-tegola, the roof and bent tiles with integrated photovoltaic cells, Cotto Possagno is dedicating a space to an artistic declination of one of its products, the “kandinsky” tile, a tribute to the founder and master of abstract art. Absolutely not to be missed!
We are waiting for you at pavilion A3 – stand 327 at the Trade Fair Center Messe München from 13 to 17 January.